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Fiber output laser system

Non-contact lead-free soldering laser unit compatible with fine thermal control resin bonding.

The fiber output laser system "FOM system" enables high-quality soldering without contact using semiconductor lasers. Soldering with a very small beam spot can handle fine soldering that is difficult to achieve manually. It can be used for various soldering applications. Additionally, it supports resin bonding, allowing laser-based resin bonding that eliminates the need for adhesives, concerns about variations in application amounts, insufficient bonding strength, and overflow, enabling highly productive bonding. 【Features】 ■ Compatible with various solder supply methods ■ Suitable for soldering workpieces that are sensitive to heat and cannot undergo reflow processes ■ Capable of creating temperature profiles tailored to the characteristics of the soldering target ■ Handles fine soldering that is difficult to achieve manually ■ Supports resin bonding *For more details, please refer to the PDF document or feel free to contact us.

  • Soldering Equipment

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